MICROFABRICATION ENGINEERING: Microlithography, Micromachining, Materials, and Process In-tegration

Most engineers learn semiconductor fabrication and MEMS fabrication as though they were two unrelated fields -- even though the two disciplines share the substantial majority of their underlying processes.
Students and early-career engineers are often left piecing their understanding together from separate, narrowly scoped references, with little acknowledgment of how closely integrated circuit and MEMS fabrication actually overlap. Many existing references were also written before extreme ultraviolet lithography, gate-all-around transistors, and chiplet-based advanced packaging became standard industry practice.
This comprehensive engineering reference treats microfabrication as the single, unified discipline it actually is, tracing one continuous process flow from crystal growth and substrate materials through lithography, thin-film deposition, etching, micromachining, packaging, and full CMOS and MEMS integration.
Inside, you will:
• Understand the shared physical and chemical principles underlying both integrated circuit and MEMS fabrication.
• Practice calculating real process outcomes, from oxide growth kinetics and dopant diffusion profiles to lithographic resolution limits and yield modeling.
• Study current industry practice, including EUV and high numerical aperture lithography, gate-all-around transistor architectures, chiplet-based advanced packaging, hybrid bonding, and backside power delivery.
• Evaluate real process tradeoffs, including wet versus dry etching, gate-first versus gate-last integration, and MEMS-CMOS co-integration strategies.
• Explore how a single wafer moves through cleanroom control, lithography, deposition, etching, and packaging as one continuous, interdependent flow.
• Rely on a fully developed reference apparatus: a subject index, glossary, list of symbols, bibliography, governing standards reference, and safety quick-reference guide.
Key topics include crystal structure and substrate materials; cleanroom technology and metrology; thermal oxidation, diffusion, and ion implantation; physical and chemical vapor deposition and epitaxy; photoresist chemistry and photolithography, including EUV and e-beam lithography; etching and chemical-mechanical planarization; bulk and surface micromachining; wafer bonding; MEMS packaging and reliability; CMOS process integration; MEMS-CMOS co-integration; advanced packaging; yield engineering and statistical process control; and emerging directions in the field.
This book is written for upper-level undergraduate and graduate engineering students studying semiconductor devices or microelectromechanical systems, early-career process and device engineers entering the semiconductor or MEMS industries, and engineering educators seeking a single, current, comprehensive course reference.
Begin building a clearer, unified understanding of microfabrication with a reference designed around the way the field actually works today.